[{"name":"R1-165072","title":"Enhancements of sidelink physical layer structure for PC5 V2V communication","source":"Intel Corporation","contact":"Seunghee Han","contact-id":47329,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"6.2.2.1","ainame":"Enhancement to sidelink physical layer structure","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-05-13 01:35:49","uploaded":"2016-05-14 06:48:33","revisionof":"","revisedto":"","release":"Rel-14","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_85\/Docs\/R1-165072.zip","group":"R1","meeting":"R1-85","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-165277","title":"L1 Format for V2V Transmissions using Sidelink","source":"Ericsson","contact":"Stefano Sorrentino","contact-id":44504,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":35,"ainumber":"6.2.2.1","ainame":"Enhancement to sidelink physical layer structure","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-05-13 09:20:03","uploaded":"2016-05-13 23:41:24","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_85\/Docs\/R1-165277.zip","group":"R1","meeting":"R1-85","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]