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{"name":"R5-221913","title":"New EVM test case applicability","source":"Qualcomm Korea, ROHDE & SCHWARZ","contact":"Ingbert Sigovich","contact-id":28887,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":544,"ainumber":"5.4.4","ainame":"TS 38.522","tdoc_agenda_sort_order":13331,"status":"agreed","reservation_date":"2022-03-06 15:10:41","uploaded":"2022-03-08 07:51:13","revisionof":"R5-221333","revisedto":"","release":"Rel-17","crspec":"38.522","crspecversion":"17.3.0","workitem":[{"winame":"TEI16_Test"}],"crnumber":156.0,"crrevision":1.0,"crcategory":"F","tsg_crp":"RP-220122","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG5_Test_ex-T1\/TSGR5_94_Electronic\/Docs\/R5-221913.zip","group":"R5","meeting":"R5-94-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]