[{"name":"R4-2315064","title":"Signaling for low MSD","source":"Qualcomm Technologies Int","contact":"Chan Fernando","contact-id":84047,"tdoctype":"other","for":"Approval","abstract":"Proposals for low MSD are presented","secretary_remarks":"","agenda_item_sort_order":161,"ainumber":"5.3.1.4","ainame":"Lower MSD for inter-band CA\/EN-DC\/DC combinations","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2023-09-25 18:14:59","uploaded":"2023-09-27 23:15:21","revisionof":"","revisedto":"","release":"Rel-18","crspec":"38.101-1","crspecversion":"","workitem":[{"winame":"NR_ENDC_RF_FR1_enh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108bis\/Docs\/R4-2315064.zip","group":"R4","meeting":"R4-108-bis","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2315237","title":"TR 38.881 v0.7.0","source":"Huawei, HiSilicon","contact":"Ye Liu","contact-id":57639,"tdoctype":"draft TR","for":"Agreement","abstract":"[Email Approval]; Session Chair: Email Approval","secretary_remarks":"","agenda_item_sort_order":161,"ainumber":"5.3.1.4","ainame":"Lower MSD for inter-band CA\/EN-DC\/DC combinations","tdoc_agenda_sort_order":0,"status":"agreed","reservation_date":"2023-09-26 12:34:37","uploaded":"2023-10-20 07:41:06","revisionof":"","revisedto":"","release":"Rel-18","crspec":"38.881","crspecversion":"0.7.0","workitem":[{"winame":"NR_ENDC_RF_FR1_enh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108bis\/Docs\/R4-2315237.zip","group":"R4","meeting":"R4-108-bis","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2315238","title":"LS on lower MSD capability","source":"Huawei, HiSilicon","contact":"Ye Liu","contact-id":57639,"tdoctype":"LS out","for":"Approval","abstract":"Reserved LS to capture the agreements during the meeting to facilitate the discussion in RAN2.","secretary_remarks":"","agenda_item_sort_order":161,"ainumber":"5.3.1.4","ainame":"Lower MSD for inter-band CA\/EN-DC\/DC combinations","tdoc_agenda_sort_order":0,"status":"approved","reservation_date":"2023-09-26 12:34:40","uploaded":"2023-10-13 08:01:08","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_ENDC_RF_FR1_enh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"RAN2","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_108bis\/Docs\/R4-2315238.zip","group":"R4","meeting":"R4-108-bis","year":2023,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]