[{"name":"R4-1800336","title":"Peak EIRP for FR2 power class","source":"Intel Corporation","contact":"Yang Tang","contact-id":56725,"tdoctype":"discussion","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":38,"ainumber":"4.3.2.1.3","ainame":"[FR2] Peak EIRP [NR_newRAT]","tdoc_agenda_sort_order":873000,"status":"noted","reservation_date":"2018-01-14 03:49:10","uploaded":"2018-01-15 22:34:21","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_newRAT"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_AHs\/TSGR4_AH-1801\/Docs\/R4-1800336.zip","group":"R4","meeting":"R4-ah-18779","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-1800405","title":"Compromise proposals for peak EIRP requirement","source":"Qualcomm Incorporated, Motorola Mobility, TMO, Sony","contact":"Ville Vintola","contact-id":44963,"tdoctype":"other","for":"Approval","abstract":"Proposals for peak EIRP value for FR2","secretary_remarks":"","agenda_item_sort_order":38,"ainumber":"4.3.2.1.3","ainame":"[FR2] Peak EIRP [NR_newRAT]","tdoc_agenda_sort_order":336000,"status":"noted","reservation_date":"2018-01-15 00:25:36","uploaded":"2018-01-15 22:35:28","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_AHs\/TSGR4_AH-1801\/Docs\/R4-1800405.zip","group":"R4","meeting":"R4-ah-18779","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-1800513","title":"EIRP level of UE power class for mmW","source":"LG Electronics France","contact":"Suhwan Lim","contact-id":46654,"tdoctype":"other","for":"Approval","abstract":"In this paper, we provide our further evaluation results for power class definitions at mmWave","secretary_remarks":"","agenda_item_sort_order":38,"ainumber":"4.3.2.1.3","ainame":"[FR2] Peak EIRP [NR_newRAT]","tdoc_agenda_sort_order":910000,"status":"noted","reservation_date":"2018-01-15 07:49:49","uploaded":"2018-01-15 09:14:53","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NR_newRAT-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_AHs\/TSGR4_AH-1801\/Docs\/R4-1800513.zip","group":"R4","meeting":"R4-ah-18779","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-1800873","title":"EIRP requirement, feasibility and associated TRP","source":"NXP Semiconductors Netherlands","contact":"Saswata Bhaumik","contact-id":75488,"tdoctype":"report","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":38,"ainumber":"4.3.2.1.3","ainame":"[FR2] Peak EIRP [NR_newRAT]","tdoc_agenda_sort_order":11060000,"status":"withdrawn","reservation_date":"2018-01-15 16:18:01","uploaded":null,"revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"","group":"R4","meeting":"R4-ah-18779","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-1800889","title":"Impact of UE back cover material on peak EIRP at mmWave","source":"Sony, Ericsson","contact":"Olof Zander","contact-id":57059,"tdoctype":"discussion","for":"Discussion","abstract":"The impact of material in the back cover has been studied. \nObservation 1. Implementation loss due to cover material for peak EIRP calculation could be less than 1dB for 28GHz band and less than 1.5dB for 39GHz band.","secretary_remarks":"","agenda_item_sort_order":38,"ainumber":"4.3.2.1.3","ainame":"[FR2] Peak EIRP [NR_newRAT]","tdoc_agenda_sort_order":889000,"status":"noted","reservation_date":"2018-01-15 18:06:34","uploaded":"2018-01-15 18:48:29","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_AHs\/TSGR4_AH-1801\/Docs\/R4-1800889.zip","group":"R4","meeting":"R4-ah-18779","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-1800891","title":"UE Power class for mmWave","source":"Sony, Ericsson","contact":"Olof Zander","contact-id":57059,"tdoctype":"other","for":"Approval","abstract":"Power class have been studied for different antenna configurations.\nProposal 1: Implementation loss due to cover material for peak EIRP calculation should be 1dB for 28GHz band and 1.5dB for 39GHz band.","secretary_remarks":"","agenda_item_sort_order":38,"ainumber":"4.3.2.1.3","ainame":"[FR2] Peak EIRP [NR_newRAT]","tdoc_agenda_sort_order":891000,"status":"noted","reservation_date":"2018-01-15 18:10:29","uploaded":"2018-01-15 18:48:29","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_AHs\/TSGR4_AH-1801\/Docs\/R4-1800891.zip","group":"R4","meeting":"R4-ah-18779","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-1800944","title":"EIRP requirement, feasibility and associated TRP","source":"NXP Semiconductors Netherlands","contact":"Saswata Bhaumik","contact-id":75487,"tdoctype":"report","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":38,"ainumber":"4.3.2.1.3","ainame":"[FR2] Peak EIRP [NR_newRAT]","tdoc_agenda_sort_order":944000,"status":"noted","reservation_date":"2018-01-15 20:50:54","uploaded":"2018-01-15 20:54:18","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_AHs\/TSGR4_AH-1801\/Docs\/R4-1800944.zip","group":"R4","meeting":"R4-ah-18779","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-1801106","title":"WF on for peak EIRP requirement","source":"Qualcomm Incorporated","contact":"Kyoungseok Oh","contact-id":66120,"tdoctype":"other","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":38,"ainumber":"4.3.2.1.3","ainame":"[FR2] Peak EIRP [NR_newRAT]","tdoc_agenda_sort_order":405000,"status":"approved","reservation_date":"2018-01-29 12:16:15","uploaded":"2018-01-29 12:45:35","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_AHs\/TSGR4_AH-1801\/Docs\/R4-1801106.zip","group":"R4","meeting":"R4-ah-18779","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]