[{"name":"S3-180642","title":"Add Skeleton for Dual Connectivity","source":"Huawei, Hisilicon","contact":"He Li","contact-id":62828,"tdoctype":"pCR","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":21,"ainumber":"4.1.4.5","ainame":"Editorials","tdoc_agenda_sort_order":6420,"status":"noted","reservation_date":"2018-02-19 03:18:30","uploaded":"2018-02-19 03:22:06","revisionof":"","revisedto":"","release":"Rel-15","crspec":33.501,"crspecversion":"0.7.0","workitem":[{"winame":"5GS_Ph1-SEC"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_SA\/WG3_Security\/TSGS3_90Bis_SanDiego\/Docs\/S3-180642.zip","group":"S3","meeting":"S3-90","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]