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{"name":"R3-186703","title":"Replication framework in 3GPP system","source":"Nokia, Nokia Shanghai Bell","contact":"Sean Kelley","contact-id":70295,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":78,"ainumber":"21.2.3","ainame":"Potential Impacts of Higher Layer Multi-Connectivity","tdoc_agenda_sort_order":25400,"status":"available","reservation_date":"2018-11-02 12:30:52","uploaded":"2018-11-02 15:18:36","revisionof":"","revisedto":"","release":"Rel-16","crspec":38.825,"crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_102\/Docs\/R3-186703.zip","group":"R3","meeting":"R3-102","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-186832","title":"Further discussion on Higher Layer Multi-Connectivity related to the Key Issue 1","source":"Ericsson","contact":"Martin Israelsson","contact-id":2462,"tdoctype":"pCR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":78,"ainumber":"21.2.3","ainame":"Potential Impacts of Higher Layer Multi-Connectivity","tdoc_agenda_sort_order":25500,"status":"available","reservation_date":"2018-11-02 21:14:24","uploaded":"2018-11-03 02:09:04","revisionof":"","revisedto":"","release":"Rel-16","crspec":38.825,"crspecversion":"0.0.1","workitem":[{"winame":"FS_NR_IIOT"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_102\/Docs\/R3-186832.zip","group":"R3","meeting":"R3-102","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-186939","title":"Remaining RAN impacts for higher layer multi-connectivity in IIoT","source":"LG Electronics","contact":"Seokjung Kim","contact-id":70180,"tdoctype":"pCR","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":78,"ainumber":"21.2.3","ainame":"Potential Impacts of Higher Layer Multi-Connectivity","tdoc_agenda_sort_order":25300,"status":"available","reservation_date":"2018-11-02 22:53:39","uploaded":"2018-11-02 23:03:14","revisionof":"","revisedto":"","release":"Rel-16","crspec":38.825,"crspecversion":"0.0.1","workitem":[{"winame":"FS_NR_IIOT"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_102\/Docs\/R3-186939.zip","group":"R3","meeting":"R3-102","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-186973","title":"Higher layer multi-connection for IIoT","source":"Huawei","contact":"Feng Han","contact-id":72237,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":78,"ainumber":"21.2.3","ainame":"Potential Impacts of Higher Layer Multi-Connectivity","tdoc_agenda_sort_order":25100,"status":"available","reservation_date":"2018-11-03 01:55:54","uploaded":"2018-11-03 05:53:12","revisionof":"","revisedto":"","release":"","crspec":38.825,"crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_102\/Docs\/R3-186973.zip","group":"R3","meeting":"R3-102","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-186974","title":"[Draft] Rely LS on the higher layer multi-connection for IIoT","source":"Huawei","contact":"Feng Han","contact-id":72237,"tdoctype":"LS out","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":78,"ainumber":"21.2.3","ainame":"Potential Impacts of Higher Layer Multi-Connectivity","tdoc_agenda_sort_order":25200,"status":"available","reservation_date":"2018-11-03 01:55:54","uploaded":"2018-11-03 05:53:12","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"SA2","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_102\/Docs\/R3-186974.zip","group":"R3","meeting":"R3-102","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-187018","title":"Response to R3-186973","source":"Ericsson","contact":"Martin Israelsson","contact-id":2462,"tdoctype":"response","for":"Agreement","abstract":"","secretary_remarks":"","agenda_item_sort_order":78,"ainumber":"21.2.3","ainame":"Potential Impacts of Higher Layer Multi-Connectivity","tdoc_agenda_sort_order":25150,"status":"available","reservation_date":"2018-11-08 22:06:37","uploaded":"2018-11-09 06:47:04","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"FS_NR_IIOT"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_102\/Docs\/R3-187018.zip","group":"R3","meeting":"R3-102","year":2018,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]