[{"name":"R1-161848","title":"Physical layer measurements for NB-IoT","source":"Nokia Networks,  Alcatel-Lucent, Alcatel-Lucent Shanghai Bell","contact":"Jorma Kaikkonen","contact-id":70304,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":11,"ainumber":"2.2.7","ainame":"Physical layer measurements","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2016-03-08 11:28:17","uploaded":"2016-03-16 14:26:07","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_AH\/LTE_NB-IoT_1603\/Docs\/R1-161848.zip","group":"R1","meeting":"R1-ah-32047","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-161865","title":"Downlink measurement for NB-IoT","source":"ZTE","contact":"Yifei Yuan","contact-id":58525,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":11,"ainumber":"2.2.7","ainame":"Physical layer measurements","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2016-03-09 11:25:39","uploaded":"2016-03-16 14:07:30","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_AH\/LTE_NB-IoT_1603\/Docs\/R1-161865.zip","group":"R1","meeting":"R1-ah-32047","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-161883","title":"Physical layer measurements","source":"Huawei, HiSilicon","contact":"Matthew Webb","contact-id":45858,"tdoctype":"other","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":11,"ainumber":"2.2.7","ainame":"Physical layer measurements","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-03-11 16:10:28","uploaded":"2016-03-16 18:45:31","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_AH\/LTE_NB-IoT_1603\/Docs\/R1-161883.zip","group":"R1","meeting":"R1-ah-32047","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-161900","title":"Physical layer measurements for NB-IoT","source":"Intel Corporation","contact":"Seunghee Han","contact-id":47329,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":11,"ainumber":"2.2.7","ainame":"Physical layer measurements","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-03-13 03:29:28","uploaded":"2016-03-16 18:21:44","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_AH\/LTE_NB-IoT_1603\/Docs\/R1-161900.zip","group":"R1","meeting":"R1-ah-32047","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-161938","title":"Physical Layer Measurements","source":"Qualcomm Inc.","contact":"Peter Gaal","contact-id":57198,"tdoctype":"other","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":11,"ainumber":"2.2.7","ainame":"Physical layer measurements","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-03-15 04:37:53","uploaded":"2016-03-16 19:01:58","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_AH\/LTE_NB-IoT_1603\/Docs\/R1-161938.zip","group":"R1","meeting":"R1-ah-32047","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R1-161969","title":"Discussions on measurement for NB-IoT","source":"LG Electronics","contact":"Yunjung Yi","contact-id":56949,"tdoctype":"other","for":"Discussion","abstract":"","secretary_remarks":"","agenda_item_sort_order":11,"ainumber":"2.2.7","ainame":"Physical layer measurements","tdoc_agenda_sort_order":0,"status":"available","reservation_date":"2016-03-15 12:43:17","uploaded":"2016-03-16 14:25:10","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG1_RL1\/TSGR1_AH\/LTE_NB-IoT_1603\/Docs\/R1-161969.zip","group":"R1","meeting":"R1-ah-32047","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]