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{"name":"C1-251679","title":"Alignment of NTZ activation procedure between TS24.301 and TS24.257","source":"LG Electronics","contact":"Sunhee Kim","contact-id":85470,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"Title modified on 3\/31\/2025. Original title : Alignment of NTZ activation procedure between TS24.301 and TS24.257 <br\/><br\/>Source modified on 3\/31\/2025. Original source : LG Electronics","agenda_item_sort_order":213,"ainumber":"19.31","ainame":"UAS_Ph3","tdoc_agenda_sort_order":16790,"status":"revised","reservation_date":"2025-03-28 09:54:35","uploaded":"2025-03-31 09:00:40","revisionof":"","revisedto":"C1-252444","release":"Rel-19","crspec":24.301,"crspecversion":"19.2.0","workitem":[{"winame":"UASAPP_Ph3"},{"winame":" UAS_Ph3"}],"crnumber":4301.0,"crrevision":"","crcategory":"B","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/tsg_ct\/WG1_mm-cc-sm_ex-CN1\/TSGC1_154_Wuhan\/Docs\/C1-251679.zip","group":"C1","meeting":"C1-154","year":2025,"uicc_affected":false,"me_affected":true,"ran_affected":false,"cn_affected":false,"clauses_affected":"6.3.13.5","crsinpack":null,"crsinpacknumber":0},
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{"name":"C1-252444","title":"Enhancement   of NTZ procedure","source":"LG Electronics, Huawei, HiSilicon, Qualcomm Incorporated, InterDigital","contact":"Akansha Arora","contact-id":98687,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"Title modified on 15\/04\/2025. Original title : Enhancement of NTZ procedure<br\/><br\/>Source modified on 15\/04\/2025. Original source : LG Electronics","agenda_item_sort_order":213,"ainumber":"19.31","ainame":"UAS_Ph3","tdoc_agenda_sort_order":16791,"status":"agreed","reservation_date":"2025-04-15 10:30:22","uploaded":"2025-04-15 10:31:11","revisionof":"C1-251679","revisedto":"","release":"Rel-19","crspec":24.301,"crspecversion":"19.2.0","workitem":[{"winame":"UAS_Ph3"}],"crnumber":4301.0,"crrevision":1.0,"crcategory":"F","tsg_crp":"CP-251205","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/tsg_ct\/WG1_mm-cc-sm_ex-CN1\/TSGC1_154_Wuhan\/Docs\/C1-252444.zip","group":"C1","meeting":"C1-154","year":2025,"uicc_affected":false,"me_affected":true,"ran_affected":false,"cn_affected":false,"clauses_affected":"6.3.13.5","crsinpack":null,"crsinpacknumber":0},
{"name":"C1-252445","title":"Enhancement of NTZ procedure","source":"LG Electronics, Huawei, HiSilicon, Qualcomm Incorporated, InterDigital","contact":"Akansha Arora","contact-id":98687,"tdoctype":"CR","for":"Agreement","abstract":"","secretary_remarks":"Source modified on 15\/04\/2025. Original source : LG Electronics","agenda_item_sort_order":213,"ainumber":"19.31","ainame":"UAS_Ph3","tdoc_agenda_sort_order":16801,"status":"agreed","reservation_date":"2025-04-15 10:30:24","uploaded":"2025-04-15 10:31:11","revisionof":"C1-251680","revisedto":"","release":"Rel-19","crspec":24.501,"crspecversion":"19.2.0","workitem":[{"winame":"UAS_Ph3"}],"crnumber":6799.0,"crrevision":1.0,"crcategory":"F","tsg_crp":"CP-251205","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/tsg_ct\/WG1_mm-cc-sm_ex-CN1\/TSGC1_154_Wuhan\/Docs\/C1-252445.zip","group":"C1","meeting":"C1-154","year":2025,"uicc_affected":false,"me_affected":true,"ran_affected":false,"cn_affected":false,"clauses_affected":"4.22.5","crsinpack":null,"crsinpacknumber":0}]