[{"name":"C3-204032","title":"23700-11 initial version","source":"Huawei, HiSilicon","contact":"haitao Wei","contact-id":48249,"tdoctype":"pCR","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":105,"ainumber":"17.6","ainame":"Study on enhanced IMS to 5GC Integration Phase 2 [FS_eIMS5G2]","tdoc_agenda_sort_order":40320,"status":"revised","reservation_date":"2020-08-11 11:02:22","uploaded":"2020-08-12 01:03:33","revisionof":"","revisedto":"C3-204290","release":"Rel-17","crspec":"23.700-11","crspecversion":"0.0.0","workitem":[{"winame":"FS_eIMS5G2"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ct\/WG3_interworking_ex-CN3\/TSGC3_111e\/Docs\/C3-204032.zip","group":"C3","meeting":"C3-111-e","year":2020,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"C3-204290","title":"23700-11 initial version","source":"Huawei, HiSilicon","contact":"Hao Jing","contact-id":83214,"tdoctype":"pCR","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":105,"ainumber":"17.6","ainame":"Study on enhanced IMS to 5GC Integration Phase 2 [FS_eIMS5G2]","tdoc_agenda_sort_order":40321,"status":"agreed","reservation_date":"2020-08-28 18:23:30","uploaded":"2020-08-28 18:31:11","revisionof":"C3-204032","revisedto":"","release":"Rel-17","crspec":"23.700-11","crspecversion":"0.0.0","workitem":[{"winame":"FS_eIMS5G2"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ct\/WG3_interworking_ex-CN3\/TSGC3_111e\/Docs\/C3-204290.zip","group":"C3","meeting":"C3-111-e","year":2020,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]