[{"name":"R4-2211749","title":"Assumptions on CPE\/FWA\/vehicle\/industrial devices","source":"SoftBank Corp.","contact":"Kenichi Kihara","contact-id":41094,"tdoctype":"other","for":"Approval","abstract":"This paper is intended for clarifying assumptions not stated in the WID: RF aprts, SAR, International roaming and UE types.","secretary_remarks":"[104-e][132] FR1_enh2","agenda_item_sort_order":554,"ainumber":"11.6.1","ainame":"General and work plan","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2022-08-08 00:27:17","uploaded":"2022-08-08 03:26:10","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_ENDC_RF_FR1_enh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_104-e\/Docs\/R4-2211749.zip","group":"R4","meeting":"R4-104-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2213725","title":"Work plan for Rel-18 FR1 UE RF enhancement","source":"Huawei, HiSilicon, NTT DOCOMO, INC","contact":"Ye Liu","contact-id":57639,"tdoctype":"other","for":"Approval","abstract":"","secretary_remarks":"[104-e][132] FR1_enh2","agenda_item_sort_order":554,"ainumber":"11.6.1","ainame":"General and work plan","tdoc_agenda_sort_order":0,"status":"approved","reservation_date":"2022-08-10 15:30:31","uploaded":"2022-08-10 16:52:25","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_ENDC_RF_FR1_enh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_104-e\/Docs\/R4-2213725.zip","group":"R4","meeting":"R4-104-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2213728","title":"TR skeleton for lower MSD","source":"Huawei, HiSilicon","contact":"Ye Liu","contact-id":57639,"tdoctype":"other","for":"Agreement","abstract":"","secretary_remarks":"[104-e][132] FR1_enh2","agenda_item_sort_order":554,"ainumber":"11.6.1","ainame":"General and work plan","tdoc_agenda_sort_order":0,"status":"agreed","reservation_date":"2022-08-10 15:30:31","uploaded":"2022-08-10 16:52:25","revisionof":"","revisedto":"","release":"Rel-18","crspec":"","crspecversion":"","workitem":[{"winame":"NR_ENDC_RF_FR1_enh2-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_104-e\/Docs\/R4-2213728.zip","group":"R4","meeting":"R4-104-e","year":2022,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]