[{"name":"RP-160495","title":"Status Report of WI: Perf. part: HSPA Dual-Band UL carrier aggregation; rapporteur: Qualcomm","source":"RAN4","contact":"Joern Krause","contact-id":12578,"tdoctype":"WI status report","for":"Discussion","abstract":"","secretary_remarks":"flag S","agenda_item_sort_order":115,"ainumber":"11.5.1","ainame":"REL-13 WI Perf. part: HSPA Dual-Band UL carrier aggregation","tdoc_agenda_sort_order":49500,"status":"noted","reservation_date":"2016-03-02 02:04:29","uploaded":"2016-03-02 02:04:29","revisionof":"","revisedto":"","release":"Rel-13","crspec":"","crspecversion":"","workitem":[{"winame":"HSUPA_DB_MC-Perf"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/tsg_ran\/TSG_RAN\/TSGR_71\/Docs\/RP-160495.zip","group":"RP","meeting":"RP-71","year":2016,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]