[{"name":"R2-1702612","title":"SDAP Specification Skeleton","source":"Huawei, HiSilicon","contact":"Hao Bi","contact-id":44845,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":126,"ainumber":"10.3.4.1","ainame":"Creation of TS","tdoc_agenda_sort_order":26120,"status":"endorsed","reservation_date":"2017-03-23 04:03:12","uploaded":"2017-03-25 04:12:32","revisionof":"","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":[{"winame":"NR_newRAT-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG2_RL2\/TSGR2_97bis\/Docs\/R2-1702612.zip","group":"R2","meeting":"R2-97","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]