[{"name":"R4-2407649","title":"On general aspects for Rel-19 LP-WUS","source":"Huawei, HiSilicon","contact":"Ye Liu","contact-id":57639,"tdoctype":"other","for":"Approval","abstract":"","secretary_remarks":"","agenda_item_sort_order":441,"ainumber":"10.14.1","ainame":"General aspects","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-11-05 07:39:58","uploaded":"2024-05-13 11:23:09","revisionof":"","revisedto":"","release":"Rel-19","crspec":"","crspecversion":"","workitem":[{"winame":"NR_LPWUS-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_111\/Docs\/R4-2407649.zip","group":"R4","meeting":"R4-111","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0},
{"name":"R4-2409100","title":"On general issues for WUR","source":"Ericsson","contact":"Chunhui Zhang","contact-id":78832,"tdoctype":"other","for":"Approval","abstract":"In this paper, we present our overview for WUR.","secretary_remarks":"","agenda_item_sort_order":441,"ainumber":"10.14.1","ainame":"General aspects","tdoc_agenda_sort_order":0,"status":"noted","reservation_date":"2024-05-13 11:49:30","uploaded":"2024-05-13 14:44:07","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_LPWUS-Core"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"https:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG4_Radio\/TSGR4_111\/Docs\/R4-2409100.zip","group":"R4","meeting":"R4-111","year":2024,"uicc_affected":"","me_affected":"","ran_affected":"","cn_affected":"","clauses_affected":"","crsinpack":null,"crsinpacknumber":0}]