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{"name":"R3-170961","title":"Fs interface user plane protocol \u2013 38.4x5","source":"Nokia, Alcatel-Lucent Shanghai Bell, KT","contact":"Tsunehiko Chiba","contact-id":70296,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":9610,"status":"revised","reservation_date":"2017-03-22 05:49:37","uploaded":"2017-03-24 14:18:22","revisionof":"","revisedto":"R3-171367","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-170961.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-170995","title":"38.4x2 CU-DU Signalling Transport Skeleton","source":"Interdigital Asia LLC","contact":"James Miller","contact-id":18834,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":9950,"status":"revised","reservation_date":"2017-03-23 15:03:06","uploaded":"2017-03-23 19:52:11","revisionof":"","revisedto":"R3-171321","release":"Rel-15","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-170995.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-170996","title":"38.4x2 CU-DU Signalling Transport Initial Inputs","source":"Interdigital Asia LLC","contact":"James Miller","contact-id":18834,"tdoctype":"discussion","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":9960,"status":"revised","reservation_date":"2017-03-23 15:06:11","uploaded":"2017-03-23 19:52:11","revisionof":"","revisedto":"R3-171363","release":"Rel-15","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-170996.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171001","title":"CU-DU interface: C-plane functions","source":"NTT DOCOMO INC.","contact":"Teruaki Toeda","contact-id":47499,"tdoctype":"discussion","for":"Approval","abstract":"In this contribution, we provide a TP for C-plane functions.","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":10010,"status":"noted","reservation_date":"2017-03-24 01:01:27","uploaded":"2017-03-24 19:26:28","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_newRAT"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171001.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171002","title":"CU-DU interface: M-plane aspects","source":"NTT DOCOMO INC.","contact":"Teruaki Toeda","contact-id":47499,"tdoctype":"discussion","for":"Approval","abstract":"In this contribution, we provide a TP for M-plane aspects.","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":10020,"status":"noted","reservation_date":"2017-03-24 01:05:27","uploaded":"2017-03-24 19:26:28","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":[{"winame":"NR_newRAT"}],"crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171002.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171004","title":"CU-DU interface: Overall categorization of C-plane and U-plane","source":"NTT DOCOMO INC.","contact":"Teruaki Toeda","contact-id":47499,"tdoctype":"discussion","for":"","abstract":"In this contribution, we provide a TP for overall categorization of C-plane and U-plane for the CU-DU interface for  the Higher layer split.","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":10040,"status":"noted","reservation_date":"2017-03-24 01:10:09","uploaded":"2017-03-24 19:26:28","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171004.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171016","title":"Stage 2 specification structure for CU-DU interface","source":"ZTE Corporation","contact":"Yin Gao","contact-id":38848,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":10160,"status":"noted","reservation_date":"2017-03-24 03:50:22","uploaded":"2017-03-24 09:40:30","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171016.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171017","title":"The proposed Stage 2 TP for CU-DU interface","source":"ZTE Corporation","contact":"Yin Gao","contact-id":38848,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":10170,"status":"noted","reservation_date":"2017-03-24 03:51:09","uploaded":"2017-03-24 09:40:45","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171017.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171230","title":"Discussion on Fast Retransmission and Path Switch between DUs for option 2 and option 3-1","source":"Huawei","contact":"Xudong Yang","contact-id":47264,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":12300,"status":"noted","reservation_date":"2017-03-25 03:15:22","uploaded":"2017-03-25 07:01:25","revisionof":"","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171230.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171321","title":"38.4x2 CU-DU Signalling Transport Skeleton","source":"Interdigital Asia LLC","contact":"Issam Toufik","contact-id":53262,"tdoctype":"other","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":9951,"status":"noted","reservation_date":"2017-05-02 03:36:15","uploaded":"2017-05-02 14:17:54","revisionof":"R3-170995","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171321.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171363","title":"38.4x2 CU-DU Signalling Transport Initial Inputs","source":"Interdigital Asia LLC","contact":"Issam Toufik","contact-id":53262,"tdoctype":"other","for":"Decision","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":9961,"status":"agreed","reservation_date":"2017-04-07 13:44:20","uploaded":"2017-04-07 13:44:20","revisionof":"R3-170996","revisedto":"","release":"Rel-15","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171363.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171364","title":"Fs Application Protocol \u2013 38.4x3","source":"Nokia, Alcatel-Lucent Shanghai Bell, KT","contact":"Issam Toufik","contact-id":53262,"tdoctype":"discussion","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":9601,"status":"agreed","reservation_date":"2017-04-07 15:01:21","uploaded":"2017-04-07 15:01:21","revisionof":"R3-170960","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171364.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0},
{"name":"R3-171367","title":"Fs interface user plane protocol \u2013 38.4x5","source":"Nokia, Alcatel-Lucent Shanghai Bell, KT","contact":"Issam Toufik","contact-id":53262,"tdoctype":"other","for":"","abstract":"","secretary_remarks":"","agenda_item_sort_order":41,"ainumber":"10.11.2","ainame":"Specification of one higher layer split","tdoc_agenda_sort_order":9611,"status":"agreed","reservation_date":"2017-04-07 15:01:21","uploaded":"2017-04-07 15:01:21","revisionof":"R3-170961","revisedto":"","release":"","crspec":"","crspecversion":"","workitem":"","crnumber":"","crrevision":"","crcategory":"","tsg_crp":"","lsreplyto":"","lsto":"","Cc":"","lsoriginalls":"","lsreply":"","link":"http:\/\/www.3gpp.org\/ftp\/TSG_RAN\/WG3_Iu\/TSGR3_95bis\/docs\/R3-171367.zip","group":"R3","meeting":"R3-95","year":2017,"uicc_affected":null,"me_affected":null,"ran_affected":null,"cn_affected":null,"clauses_affected":null,"crsinpack":null,"crsinpacknumber":0}]